Melexis’ ToF 3D vision chip
- الكاتب:Ella Cai
- الافراج عن:2017-06-16
Melexis, the Belgian auto IC specialist, has a Time-of-Flight (ToF) chipset and development kit for implementing 3D vision.
Melexis, the Belgian auto IC specialist, has a Time-of-Flight (ToF) chipset and development kit for implementing 3D vision.
“The simplicity that it brings to the design process will ensure that more applications will be able to benefit from 3D TOF vision,” says Melexis’ Gaetan Koers.
Previously available only as part of a development system, the chipset is now available to designers everywhere.
The chipset includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution. Designers no longer need external FPGAs and ADCs.
The MLX75023 ToF sensor has QVGA resolution with 63 dB linear dynamic range and sunlight robustness. The MLX75123 companion chip directly interfaces the sensor IC to a host MCU and provides rapid readout of data from the sensor.
The modular approach taken in designing the chipset means that the sensor can be changed / upgraded without having to change the product architecture. This allows the design of multiple solutions with the same base design as well as rapid implementation of new sensors as they reach the market.
The chipset is available in both automotive (-40°C to +105°C) and industrial (-20°C to +85°C) grades.
Melexis, the Belgian auto IC specialist, has a Time-of-Flight (ToF) chipset and development kit for implementing 3D vision.
“The simplicity that it brings to the design process will ensure that more applications will be able to benefit from 3D TOF vision,” says Melexis’ Gaetan Koers.
Previously available only as part of a development system, the chipset is now available to designers everywhere.
The chipset includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution. Designers no longer need external FPGAs and ADCs.
The MLX75023 ToF sensor has QVGA resolution with 63 dB linear dynamic range and sunlight robustness. The MLX75123 companion chip directly interfaces the sensor IC to a host MCU and provides rapid readout of data from the sensor.
The modular approach taken in designing the chipset means that the sensor can be changed / upgraded without having to change the product architecture. This allows the design of multiple solutions with the same base design as well as rapid implementation of new sensors as they reach the market.
The chipset is available in both automotive (-40°C to +105°C) and industrial (-20°C to +85°C) grades.
