ST launches 3.26mm2 matched balun
- Auteur:Ella Cai
- Relâchez le:2017-12-19
ST has introduced a 3.26mm2 matched balun for its S2-LP 868-927MHz low-power radio transceiver which integrates all the impedance-matching and filtering components needed to connect an antenna to the S2-LP radio.
It replaces a conventional network of 16 discrete capacitors and inductors that can occupy up to 100mm2 of board real-estate — a footprint reduction of more than 96%.
Circuit design is simplified with no need to select component values or tackle layout challenges. Fully optimized for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximize RF performance.
The 3.26mm2 BALF-SPI2-01D3 is the latest in ST’s family of integrated baluns. There are now 16 devices, in package sizes down to 0.8mm2 and just 0.56mm high after reflow, for use with ST’s sub-1GHz or Bluetooth® low energy 2.4GHz radios, as well as with various transceivers from other manufacturers.
As a critical enabling technology for these highly integrated matching devices, ST’s Integrated Passive Device (IPD) on non-conductive glass-substrate ensures low RF signal losses, with low amplitude and phase imbalances, ultimately resulting in superior RF-subsystem performance and longer operating life for battery-powered devices.
The BALF-SPI2-01D3 is in production now, in a 6-bump 2.1mm x 1.55mm chip-scale package, priced from $0.176 for orders of 500 units.
It replaces a conventional network of 16 discrete capacitors and inductors that can occupy up to 100mm2 of board real-estate — a footprint reduction of more than 96%.
Circuit design is simplified with no need to select component values or tackle layout challenges. Fully optimized for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximize RF performance.
The 3.26mm2 BALF-SPI2-01D3 is the latest in ST’s family of integrated baluns. There are now 16 devices, in package sizes down to 0.8mm2 and just 0.56mm high after reflow, for use with ST’s sub-1GHz or Bluetooth® low energy 2.4GHz radios, as well as with various transceivers from other manufacturers.
As a critical enabling technology for these highly integrated matching devices, ST’s Integrated Passive Device (IPD) on non-conductive glass-substrate ensures low RF signal losses, with low amplitude and phase imbalances, ultimately resulting in superior RF-subsystem performance and longer operating life for battery-powered devices.
The BALF-SPI2-01D3 is in production now, in a 6-bump 2.1mm x 1.55mm chip-scale package, priced from $0.176 for orders of 500 units.
