Helix aims for ‘zero-power’ in smart grids
- Autore:Ella Cai
- Rilasciare il:2017-07-13
Fabless power semiconductor firm Helix Semiconductors is sampling its first production chip for use in electricity grids.
Dubbed ‘Zero Power,’ the goal is specified as less than or equal to 5mW.
Based on a patented MuxCapacitor voltage reduction technology, the eMpower HS100 is capacitive-based and is designed to offer high efficiency even in light load and no load scenarios.
According to Helix, when converting AC mains to 5Vdc the the device achieves more than 90% end-to-end efficiency from its full load range of 10W all the way down to 100mA, which represents 5% of full load.
Likely applications include IoT gateways, remote sensors and smart LED lighting.
Harold A. Blomquist, president and CEO of Helix Semiconductors, writes:
“We are currently developing future implementations of our eMpower HS100 in smaller geometries, which will open the door for more applications to experience unprecedented power efficiencies.
“Next-generation products include a 0.18 micron chipset for higher power applications, initially targeting 30W, and a 48V DC-DC device for Power over Ethernet, electric/hybrid vehicles and datacom/telecom applications.”
The US firm says it can reduce the power consumed by electronic appliances when in an inactive, or standby, mode.
Dubbed ‘Zero Power,’ the goal is specified as less than or equal to 5mW.
Based on a patented MuxCapacitor voltage reduction technology, the eMpower HS100 is capacitive-based and is designed to offer high efficiency even in light load and no load scenarios.
According to Helix, when converting AC mains to 5Vdc the the device achieves more than 90% end-to-end efficiency from its full load range of 10W all the way down to 100mA, which represents 5% of full load.
Likely applications include IoT gateways, remote sensors and smart LED lighting.
Harold A. Blomquist, president and CEO of Helix Semiconductors, writes:
“We are currently developing future implementations of our eMpower HS100 in smaller geometries, which will open the door for more applications to experience unprecedented power efficiencies.
“Next-generation products include a 0.18 micron chipset for higher power applications, initially targeting 30W, and a 48V DC-DC device for Power over Ethernet, electric/hybrid vehicles and datacom/telecom applications.”
