7nm Customer SoCs from Globalfoundries in H1 2018
- 著者:Ella Cai
- 公開：:2017-06-14
Globalfoundries has announced the roll-out of its 7nmFinFET semiconductor technology, with design kits available now, first customer chips launching in H1 2018 and volume production in H2.
GloFo’s LP 7nm process claims to deliver 40% better performance and twice the area scaling than its 14nm process. The 7nm process is being run at Fab 8 in Saratoga County, New York State (pictured).
“Our 7nm FinFET technology development is on track and we are seeing strong customer traction, with multiple product tapeouts planned in 2018,” says GloFo svp Gregg Bartlett, “and, while driving to commercialize 7nm, we are actively developing next-generation technologies at 5nm and beyond.”
GloFo announced a 7nm test chip in 2015, followed by this month’s announcement of the industry’s first demonstration of a functioning 5nm chip using silicon nanosheet transistors. GF is exploring a range of new transistor architectures to enable its customers to deliver the next era of connected intelligence.
GF’s 7nm FinFET technology leverages the company’s volume manufacturing experience with its 14nm FinFET technology, which began production in early 2016 at Fab 8. Since then, the company has delivered “first-time-right” designs for a broad range of customers.
To accelerate the 7LP production ramp, GF is investing in new process equipment capabilities, including the addition of the first two EUV lithography tools in the second half of this year. The initial production ramp of 7LP will be based on an optical lithography approach, with migration to EUV lithography when the technology is ready for volume manufacturing.
GloFo’s LP 7nm process claims to deliver 40% better performance and twice the area scaling than its 14nm process. The 7nm process is being run at Fab 8 in Saratoga County, New York State (pictured).
“Our 7nm FinFET technology development is on track and we are seeing strong customer traction, with multiple product tapeouts planned in 2018,” says GloFo svp Gregg Bartlett, “and, while driving to commercialize 7nm, we are actively developing next-generation technologies at 5nm and beyond.”
GloFo announced a 7nm test chip in 2015, followed by this month’s announcement of the industry’s first demonstration of a functioning 5nm chip using silicon nanosheet transistors. GF is exploring a range of new transistor architectures to enable its customers to deliver the next era of connected intelligence.
GF’s 7nm FinFET technology leverages the company’s volume manufacturing experience with its 14nm FinFET technology, which began production in early 2016 at Fab 8. Since then, the company has delivered “first-time-right” designs for a broad range of customers.
To accelerate the 7LP production ramp, GF is investing in new process equipment capabilities, including the addition of the first two EUV lithography tools in the second half of this year. The initial production ramp of 7LP will be based on an optical lithography approach, with migration to EUV lithography when the technology is ready for volume manufacturing.
