3D NAND to overtake 2D in Q4
- 저자:Ella Cai
- 에 출시:2017-04-20
3D NAND output will overtake 2D output in Q4, reports Digitimes.
Samsung is expected to ramp 64-layer NAND in H2 with a new plant coming on-stream in Pyeongtaek in July.
Micron is expected to be in volume production of 64-level 3D NAND in Q2.
Toshiba is producing 64-layer chips and Hynix says it has a 72-layer chip.
Yields, which were poor, have now improved and the general expectation for NAND is that supply constraints will ease in H2.
Samsung is expected to ramp 64-layer NAND in H2 with a new plant coming on-stream in Pyeongtaek in July.
Micron is expected to be in volume production of 64-level 3D NAND in Q2.
Toshiba is producing 64-layer chips and Hynix says it has a 72-layer chip.
Yields, which were poor, have now improved and the general expectation for NAND is that supply constraints will ease in H2.
