Sony to sample 7.42MP stacked CMOS image sensor
- 저자:Ella Cai
- 에 출시:2017-10-24
Sony says it will sample, next month, a stacked CMOS sensor with an ‘effective’ 7.42 Mega-Pixels.
Sony sees it as an image sensor for cameras enabling ADAS and says it can capture a high-definition image of road signs approximately 160 metres ahead.
The sensor is equipped with a pixel binning mode for raising the sensitivity in low-light environments, achieving sensitivity of 2666 mV, making it possible to capture images of pedestrians and obstacles ‘even in dark situations that are equivalent to the brightness of moonlight’, says Sony.
Even in environments with uneven, mixed levels of brightness, due to headlights and streetlights when driving at night, the sensor is equipped with a function that alternately captures dark sections at high-sensitivity settings and bright sections at high resolution, enabling high-precision image recognition when combined with the signal processing of the latter stage.
This is the first time in the industry where a stacked configuration has been employed on an automotive grade sensor, claims Sony. This arranges the pixel array and signal processing circuit in layers to allow for a compact size and low power consumption while still delivering high resolution.
This sensor is planned to meet the AEC-Q100 Grade 2 reliability testing standards for automotive electronic components by June 2018.
Sony sees it as an image sensor for cameras enabling ADAS and says it can capture a high-definition image of road signs approximately 160 metres ahead.
The sensor is equipped with a pixel binning mode for raising the sensitivity in low-light environments, achieving sensitivity of 2666 mV, making it possible to capture images of pedestrians and obstacles ‘even in dark situations that are equivalent to the brightness of moonlight’, says Sony.
Even in environments with uneven, mixed levels of brightness, due to headlights and streetlights when driving at night, the sensor is equipped with a function that alternately captures dark sections at high-sensitivity settings and bright sections at high resolution, enabling high-precision image recognition when combined with the signal processing of the latter stage.
This is the first time in the industry where a stacked configuration has been employed on an automotive grade sensor, claims Sony. This arranges the pixel array and signal processing circuit in layers to allow for a compact size and low power consumption while still delivering high resolution.
This sensor is planned to meet the AEC-Q100 Grade 2 reliability testing standards for automotive electronic components by June 2018.
