Toshiba demo-es 64-layer 3D NAND
- Autor:Ella Cai
- Solte em:2017-05-10
Toshiba has demo-ed 64-layer BiCS FLASH TLC 3D NAND technology on an XG Series client NVMe PCIe SSD.
The 512Gbit device has 3-bit-per-cell (TLC) technology.
It is based on the third generation 64-layer stacking process featuring 65% greater bit density per mm2 than Toshiba’s 48-layer, 256GB (32 gigabyte) device.
Toshiba is currently migrating all client, data center and enterprise SSDs to the newest BiCS FLASH 64-layer 3D memory.
The 512Gbit device has 3-bit-per-cell (TLC) technology.
It is based on the third generation 64-layer stacking process featuring 65% greater bit density per mm2 than Toshiba’s 48-layer, 256GB (32 gigabyte) device.
Toshiba is currently migrating all client, data center and enterprise SSDs to the newest BiCS FLASH 64-layer 3D memory.
