- 2017-09-19Plastic Logic strengthens ties with E Ink for flexible displays
- 2017-09-18Korea to invest $46bn in ICs and displays by 2024
- 2017-09-18CEVA licenses vision chip to Nextchip
- 2017-09-18Amazon deal opens use of accelerated Xilinx FPGA software design
- 2017-09-18Samsung invests in safety-critical Ethernet networks for cars and satellites
- 2017-09-18Socionext integrates codec and video processor for server module
- 2017-09-15Siemens and Tsinghua set up robotics R&D centre in Beijing
- 2017-09-15LTE-enabled smartwatches to drive wearables growth
- 2017-09-15Philips and Renault demo smart car-home interaction
- 2017-09-15Socionext joins XVTEC to pursue video over IP
- 2017-09-15Samsung and China drive fab equipment spend past $55bn
- 2017-09-13Cloud based software will manage test kit’s use and maintenance
- 2017-09-13Mouser stocking Bluefruit
- 2017-09-13Cardiff Cluster gets regional authorities’ backing
- 2017-09-13Codeplay teams with Renesas to create 30 jobs in Edinburgh
- 2017-09-13JEDEC committee formed for wide bandgap semis
- 2017-09-12Stanford facial recognition software spots gay people
- 2017-09-12Toshiba in production of high current photorelays
- 2017-09-12Murata RFID tag works on metal
- 2017-09-12Microchip MPLAB Harmony 2.0 available as free download
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