Coil on Module for secure wireless payments
- ผู้เขียน:Ella Cai
- ปล่อยบน:2017-11-29
Infineon is expanding its CoM (Coil on Module) portfolio for secure contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate monoblock inlay.
Conventional chip packages are welded, soldered or glued to the card antenna. With the CoM package, however, the chip module communicates with the card antenna by radio frequency (RF). The complex mechanical design is no longer necessary, the card itself becomes more robust and production costs are reduced.
CoM packages are already used for numerous payment and eID cards, which function both contact-based and contactless (dual interface). Yet, CoM technology also offers significant advantages for purely contactless eID cards and passports:
Flexible card layout with world’s thinnest module, measuring only 125µm for improved card design and less rigid passports
Improved robustness for documents with ten years validity thanks to elimination of weak points through electro mechanical card antenna connection
One-stop-shopping shortens and simplifies the supply chain
New chip generation for consumer-friendly contactless cards
Transactions with contactless cards are typically much faster than with contact-based cards that must be inserted into the reader. Multi-application, in turn, combines several applications in a single card and allows new business models. Multifunctional eIDs and sovereign ID documents are for example in high demand in areas with relatively poor banking infrastructure in Africa and Latin America: thus, citizens there can also use their ID card for financial transactions.
However, multi-application cards require more storage capacity and special security structures when it comes to the chip solution and Infineon’s chip has up to 700KB.
Conventional chip packages are welded, soldered or glued to the card antenna. With the CoM package, however, the chip module communicates with the card antenna by radio frequency (RF). The complex mechanical design is no longer necessary, the card itself becomes more robust and production costs are reduced.
CoM packages are already used for numerous payment and eID cards, which function both contact-based and contactless (dual interface). Yet, CoM technology also offers significant advantages for purely contactless eID cards and passports:
Flexible card layout with world’s thinnest module, measuring only 125µm for improved card design and less rigid passports
Improved robustness for documents with ten years validity thanks to elimination of weak points through electro mechanical card antenna connection
One-stop-shopping shortens and simplifies the supply chain
New chip generation for consumer-friendly contactless cards
Transactions with contactless cards are typically much faster than with contact-based cards that must be inserted into the reader. Multi-application, in turn, combines several applications in a single card and allows new business models. Multifunctional eIDs and sovereign ID documents are for example in high demand in areas with relatively poor banking infrastructure in Africa and Latin America: thus, citizens there can also use their ID card for financial transactions.
However, multi-application cards require more storage capacity and special security structures when it comes to the chip solution and Infineon’s chip has up to 700KB.
