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Maison > Nouvelles > Industry News > TSMC looks at e-beam as possib.....

TSMC looks at e-beam as possible alternative to EUV

  • Auteur:Ella Cai
  • Relâchez le:2017-04-27
TSMC is looking at an e-beam lithography tool made by the Dutch firm Mapper as a possible alternative to EUV.

The Mapper tool uses 110 e-beams and could, according to TSMC’s Burn Lin, process 150 wafers an hour which is the same rate as ASML’s latest EUV machine.

According to Lin, who is vp for R&D and head of the Nano-Technology Patterning division at TSMC, the Mapper tool could do this at one third the cost of EUV wafers.

Furthermore the tool could enable 450mm wafers – which is a deferred aspiration for the chip industry.

“It’s the only way I know to reduce costs while shifting to a larger wafer size,” said Lin at the SPIE Advanced Lithography conference in San Jose.