TSMC looks at e-beam as possible alternative to EUV
- 저자:Ella Cai
- 에 출시:2017-04-27
TSMC is looking at an e-beam lithography tool made by the Dutch firm Mapper as a possible alternative to EUV.
The Mapper tool uses 110 e-beams and could, according to TSMC’s Burn Lin, process 150 wafers an hour which is the same rate as ASML’s latest EUV machine.
According to Lin, who is vp for R&D and head of the Nano-Technology Patterning division at TSMC, the Mapper tool could do this at one third the cost of EUV wafers.
Furthermore the tool could enable 450mm wafers – which is a deferred aspiration for the chip industry.
“It’s the only way I know to reduce costs while shifting to a larger wafer size,” said Lin at the SPIE Advanced Lithography conference in San Jose.
The Mapper tool uses 110 e-beams and could, according to TSMC’s Burn Lin, process 150 wafers an hour which is the same rate as ASML’s latest EUV machine.
According to Lin, who is vp for R&D and head of the Nano-Technology Patterning division at TSMC, the Mapper tool could do this at one third the cost of EUV wafers.
Furthermore the tool could enable 450mm wafers – which is a deferred aspiration for the chip industry.
“It’s the only way I know to reduce costs while shifting to a larger wafer size,” said Lin at the SPIE Advanced Lithography conference in San Jose.
